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Plasma FIB-FESEM Workstation Introduced By Tescan
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Tescan has launched the FERA3 XMH - a high resolution Schottky Field Emission scanning electron microscope with a fully integrated Plasma source focused ion beam. The system has been developed in co-operation with the French company Orsay Physics.
Configuration Possibilities
FERA3 XMH Plasma FIB-FESEM can be configured with the following systems:
• Gas Injection Systems
• Nano- Manipulators
• Detectors including SE detector, BSE detector, Secondary Ion detector, Cathodoluminescence detector, EDX, and EBSD microanalyzers
The use of a Xenon plasma source for the focused ion beam allows the FERA3 to satisfy high resolution FIB requirements (imaging, fine milling/polishing), as well as achieving high ion currents needed for ultra-fast material removal rates. The resolution of the plasma ion beam is <100 nm and the maximum Xe ion current is > 1 µA. Compared to existing FIB technologies with gallium sources, the material removal rate achievable for silicon with the Plasma FIB is over 30x faster. For this reason the FERA3 XMH is well suited for applications requiring the removal of large volumes of material, particularly in the semiconductor packaging corridor where TSV technology is being utilized.
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Keywords: FERA3 FERA3 XMH FESEM FIB FIB-FESEM FIB-SEM Field Emission Electron Microscopy Field Emission Scanning Electron Microscope Focused Ion Beam Nano-Manipulation Orsay Physics Tescan Workstation
Tescan a.s
Libušina třída 21
623 00 Brno
Czech Republic
Tel: +420 547 130 411
Fax: +420 547 130 415
Web: http://www.tescan.com
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