Products
Dual-Core 3D Measuring
Combining Confocal Microscopy and Interferometry
 |
The Dual-Core 3D Measuring Microscope Leica DCM 3D combines confocal microscopy, interferometry and color imaging in one sensor head. Designed for R&D and quality labs or automatic online process control, the system offers fast and contact-free analysis of the micro- and nanogeometry of material surfaces to an accuracy of 0.1 nm. A confocal microdisplay, two light sources and two CCD cameras produce unlimited field depth and highly precise 3D results. As it requires no mechanically moving parts, the DCM 3D is practically maintenance-free. Interferometry PSI and VSI provides a high precision measurement of smooth surfaces with sub-nanometer resolution. Due to fast, non-destructive 3D measurements sample preparation are not necessary unlike for SEM (Scanning Electron Microscopy) Interferometry PSI and VSI.
Related Articles :
- LSM 7 Series from Carl Zeiss With New Possibilities
- XFlash 6: Pushing the Limits of Energy Resolution
- Analyzing Biomaterials by Nanofocus Computed Tomography
- Imaging Software from Molecular Devices is Integrated in Andor´s Revolution DSD
- Leica TCS CARS: First Confocal System With CARS Imaging
Keywords: Color Imaging confocal microscopy DCM 3D Dual-Core 3D interferometry Leica R&D Scanning Electron Microscopy SEM
Leica Microsystems GmbH
Ernst-Leitz-Str. 17-37
D-35578 Wetzlar
Germany
Tel: +49 6441 29 4000
Fax: +49 6441 29 4155
Web: http://www.leica-microsystems.com
Imaging & Microscopy Issue 4 as free epaper or pdf download
- Legal
- Help
- Participate
- Related Publications
Reader comments (0)