Helios NanoLab x50
May. 18, 2010
FEI Company introduced the Helios NanoLab x50 DualBeam Series. The Helios 450 series is designed primarily for today's advanced semiconductor labs that are dealing with numerous challenges, including shrinking dimensions at sub 32nm nodes; advanced packaging techniques, such as TSVs and multi-die stacks; as well as a higher volume of samples requiring TEM imaging. The Helios 650 is designed for academic and industrial research centers that need to do advanced material characterization and modification down to the single nanometer scale.
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