Mar. 22, 2011

Cobolt Introduces DPSS Laser for Flow Cytometry and Super-Resolution Microscopy

Cobolt AB has announced the release of Cobolt Jive 05-01, a DPSS laser perfectly suited for advanced flow cytometry and super-resolution microscopy.
The Cobolt Jive 05-01 is a continuous-wave single-frequency DPSS laser operating at 561 nm in a perfect quality TEM00 beam (M2<1.1). It is available with up to 300 mW output power on the single-frequency 05-01 Series platform. moreMar. 18, 2011

NASA Equipes ISS with a Light Microscope

NASA has started fluid physics experiments on ISS by using a multi-capability light microscope. Four experiments will help scientists to study the effects of the space environment on physical and biological elements. moreJan. 25, 2011

Confocal and High Resolution Raman Microscopy

Laser 2000 now offers a 785nm Laser:
The LaserBoxx laser diode module from Oxxius is now available in single frequency at 785nm wavelength at output power of up to 100mW in circular diffraction limited beam. Its stabilization technique ensures less than 10 MHz linewidth and long-term wavelength stability. moreJan. 19, 2011

Thorlabs Continues Expansion of OCT Product Line

Thorlabs introduces their 55 kHz swept source OCT (SS-OCT) imaging system, which employs a novel tunable filter technology with a highly efficient laser cavity design to achieve a broad wavelength tuning range (>120 nm) at high sweep rates. moreJul. 07, 2010

Ultra-low Noise 1064 nm

Cobolt AB announces the release of a new wavelength on the single-frequency 05-01 platform. The new Cobolt Rumba operates at 1064 nm with up to 2 W CW output power and is suited to demanding applications such as high resolution Raman spectroscopy, interferometry and optical tweezers experiments. moreMay. 06, 2010

Combining Confocal Microscopy and Interferometry

Sensofar-Tech and Leica Microsystems have agreed to expand their cooperation whereby Sensofar is to supply technology and components for an optical system that complements Leica's line of products for industrial applications. Leica Microsystems will utilize the Sensofar technology plus Leica Microsystems' high-end optical objectives to provide a new and complete solution for optical profiling and 3D surface metrology with a vertical accuracy down to 0.1 nm. moreApr. 01, 2010

Dual-Core 3D Measuring

The Dual-Core 3D Measuring Microscope Leica DCM 3D combines confocal microscopy, interferometry and color imaging in one sensor head. Designed for R&D and quality labs or automatic online process control, the system offers fast and contact-free analysis of the micro- and nanogeometry of material surfaces to an accuracy of 0.1 nm. A confocal microdisplay, two light sources and two CCD cameras produce unlimited field depth and highly precise 3D results. As it requires no mechanically moving parts, the DCM 3D is practically maintenance-free. moreMar. 10, 2010

Optical Micro- and Nano- Metrology

To image and measure small structures, forms and surface roughness has become more easy, fast and versatile with the Sensofar PLµ Neox, distributed by the Schaefer-Tec group. The optical profilometers of the PLµ series combine the two complementary measuring techniques of confocal microscopy and interferometry in one and the same instrument. With this, high resolution 3-D imaging and dimensional measurements of nearly all kinds of surfaces are obtained easily and fast. moreNov. 14, 2009

Confocal and Interferometer Profiler in one

Schaefer-Tec launched the new Sensofar PLµ NEOX optical profiler that combines the complementary measuring methods confocal and interferometry in one instrument. The integrated piezo scanner provides a vertical resolution of down to 0.01nm in the Phaseshifting Interferometry mode while the linear stage allows for up to 40 mm vertical scanrange. Sensofars patented microdisplay-based confocal scanning technology works without moving parts and guarantees a very long lifetime without maintenance. moreNov. 03, 2009

Deep 3D Optical Metrology

Confocal technique and white light interferometry have demonstrated to be suitable for characterization of transparent thick films. Layer's thickness and 3D topographies of its upper and lower interfaces can be determined from the two peaks in the confocal axial response or from the two sets of interference fringes developed during a vertical scan. Refraction index mismatch between immersion medium and layer worsens the performance of these techniques when profiling lower surface.

Surface Profiling Techniques
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