Sep. 05, 2011

Phase Growth in Wire Bond Interconnects - Microstructural Characterization by EBSD

Gold wire bonding on aluminium pads plays an important role in microelectronic packaging. The reliability and lifetime of the interconnection is determined by intermetallic phases formed at the Au/Al interface. Five phases are stable at room temperature. Some of them are supposed to undergo degradation pro­cesses due to mechanical stress or chemical reactions during IC lifetime. For microstructural characterization, investigations by EBSD are applied as an alternative to expensive TEM analyses.

Introduction
more