Wire Bond Interconnects
Sep. 05, 2011
Gold wire bonding on aluminium pads plays an important role in microelectronic packaging. The reliability and lifetime of the interconnection is determined by intermetallic phases formed at the Au/Al interface. Five phases are stable at room temperature. Some of them are supposed to undergo degradation processes due to mechanical stress or chemical reactions during IC lifetime. For microstructural characterization, investigations by EBSD are applied as an alternative to expensive TEM analyses.