Whether you work with polymers, gold wire bonding, electronics, coatings, glass, steel, multi-layered samples using the right sequence and combination of tools will decrease the preparation time of your samples by up to 70%.

Leica Microsystems workflow solutions cover all steps required for demanding high-quality EM sample preparation, whatever the nature of your sample.

The EM TXP system offers milling, sawing, grinding, and polishing all in one instrument. The EM TIC 3X milling machine allows the production of cross sections and plane surfaces for Scanning Electron Microscopy (SEM), Microstructure Analysis (EDS, WDS, Auger, EBSD), AFM, and Incident Light Microscopy investigation. The Ultramicrotome Leica EM UC7 provides easy preparation of semi- and ultrathin sections as well as perfect, smooth surfaces of biological and industrial samples for TEM, SEM, AFM and LM examination.

Learn on this special website, how Leica Microsystems´ solutions cover all steps required for demanding high-quality sample preparation in various application areas. The articles are freely accessible due to a friendly sponsoring by Leica Microsystems.

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