Dec. 05, 2018
News

On-Demand Webinar: New Technique for Quick 3D Imaging of Alloy Defects

Fast 3D Imaging: Milling and In Situ Microscopy

Aluminum (Al) alloys play an important role in the production of aircraft and vehicles, as well as products in other industries. Defects present in the Al alloy used for the production of aircraft, vehicles, or other products can have a significant effect on their quality, performance, and lifetime. Characterization of Al alloys in 3D can lead to a better understanding of defect formation and how to minimize or eliminate it.

In this webinar you will learn how to acquire 3D-images of macroscale defects in non-transparent alloys up to 6 times faster compared to current sample preparation and imaging approaches. The On-Demand version is now available.

Leica specialist - Wolfgang Gruenewald - will introduce step by step the entire workflow for Al alloy sample preparation and 2D imaging recording.

The following questions will be answered:
• Is polishing a suitable way to prepare surfaces?
• Is milling a method of choice to get surfaces in a quality good enough for 3D reconstructions?
• How can be 2D images recorded after each step? 

Who should attend:
• SEM Users
• Engineers and researchers from companies and academics working with material samples

About the presenter:
Dr. Wolfgang Grünewald studied Physics from 1975 to 1980. In his diploma and dissertation at the Institute of Physics Technical University of Chemnitz, he dealt with TEM investigation of thin films and ion milling as an appropriate sample preparation method. Since 2008, he has worked as a worldwide Application Specialist at Leica Microsystems for solid states. He has been responsible for 5 patent submissions and wrote several publications.

Register for free: here 

Contact

Leica Microsystems GmbH
Ernst-Leitz-Str. 17-37
D-35578 Wetzlar
Germany
Phone: +49 6441 29 4000
Telefax: +49 6441 29 4155

Register now!

The latest information directly via newsletter.

To prevent automated spam submissions leave this field empty.